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HIN232, HIN236, HIN237,HIN238, HIN239, HIN240, HIN241
Data Sheet May 2002 FN3138.11
+5V Powered RS-232 Transmitters/Receivers
The HIN232-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where 12V is not available. They require a single +5V power supply (except HIN239) and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300 power-off source impedance. The receivers can handle up to 30V, and have a 3k to 7k input impedance. The receivers also feature hysteresis to greatly improve noise rejection.
Features
* Meets All RS-232E and V.28 Specifications * Requires Only Single +5V Power Supply - (+5V and +12V - HIN239) * High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps * Onboard Voltage Doubler/Inverter * Low Power Consumption * Low Power Shutdown Function * Three-State TTL/CMOS Receiver Outputs * Multiple Drivers - 10V Output Swing for 5V lnput - 300 Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/s Maximum Slew Rate * Multiple Receivers - 30V Input Voltage Range - 3k to 7k Input Impedance - 0.5V Hysteresis to Improve Noise Rejection
Applications
* Any System Requiring RS-232 Communication Ports - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems
Selection Table
PART NUMBER HIN232 HIN236 HIN237 HIN238 HIN239 HIN240 HIN241 POWER SUPPLY VOLTAGE +5V +5V +5V +5V +5V and +7.5V to 13.2V +5V +5V NUMBER OF RS-232 DRIVERS 2 4 5 4 3 5 4 NUMBER OF RS-232 RECEIVERS 2 3 3 4 5 5 5 EXTERNAL COMPONENTS 4 Capacitors 4 Capacitors 4 Capacitors 4 Capacitors 2 Capacitors 4 Capacitors 4 Capacitors LOW POWER SHUTDOWN/TTL THREE-STATE NO/NO YES/YES NO/NO NO/NO NO/YES YES/YES YES/YES NUMBER OF LEADS 16 24 24 24 24 44 28
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved
HIN232 thru HIN241 Ordering Information
PART NUMBER HIN232CB HIN232CB-T HIN232CP HIN232IB HIN232IP HIN236CB HIN236CP HIN236IB HIN237CB HIN237CB-T HIN238CB TEMP. RANGE ( oC) 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 -40 to 85 0 to 70 0 to 70 0 to 70 PACKAGE 16 Ld SOIC Tape and Reel 16 Ld PDIP 16 Ld SOIC 16 Ld PDIP 24 Ld SOIC 24 Ld PDIP 24 Ld SOIC 24 Ld SOIC Tape and Reel 24 Ld SOIC M24.3 E16.3 M16.3 E16.3 M24.3 E24.3 M24.3 M24.3 PKG. NO. M16.3
Ordering Information
PART NUMBER HIN238CB-T HIN238CP HIN238IB HIN239CB HIN239CB-T HIN239CP HIN239IB HIN240CN HIN241CA HIN241CB HIN241IB TEMP. RANGE ( oC) 0 to 70 0 to 70 -40 to 85 0 to 70 0 to 70 0 to 70 -40 to 85 0 to 70 0 to 70 0 to 70 -40 to 85
(Continued)
PACKAGE Tape and Reel 24 Ld PDIP 24 Ld SOIC 24 Ld SOIC Tape and Reel 24 Ld PDIP 24 Ld SOIC 44 Ld MQFP 28 Ld SSOP 28 Ld SOIC 28 Ld SOIC
PKG. NO.
E24.3 M24.3 M24.3
E24.3 M24.3 Q44.10X10 M28.209 M28.3 M28.3
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT EN SHUTDOWN NC Power Supply Input 5V 10%. Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V. Internally generated negative supply (-10V nominal). Ground lead. Connect to 0V. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. Transmitter Outputs. These are RS-232 levels (nominally 10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5k pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high impedance state. Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. No Connect. No connections are made to these leads. FUNCTION
2
HIN232 thru HIN241 Pinouts
HIN232 (PDIP, SOIC) TOP VIEW
C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V6 16 VCC 15 GND 14 T1OUT 13 R1IN 12 R1OUT 11 T1IN 10 T2IN 9 R2OUT T3OUT T1OUT T2OUT R1 IN R1OUT T2IN T1IN GND VCC 1 2 3 4 5 6 7 8 9
HIN236 (PDIP, SOIC) TOP VIEW
24 T4OUT 23 R2IN 22 R2OUT 21 SHUTDOWN 20 EN 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+
T2OUT 7 R2IN 8
C1+ 10 V+ 11 C1- 12
+5V + 1F 16 1F 2 + NOTE 1 1F 10 C1+ + 12 C113 C2+ + 14 C2+5V 9 VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 1F
1 NOTE 1 + 3 4 NOTE 1 + 5
VCC C1+ C1C2+ C2+5V TO 10V VOLTAGE DOUBLER V+
V- 15 + 2 1F T1OUT
+10V TO -10V VOLTAGE INVERTER
V- 6 + NOTE 1
T1 IN
+5V 400k 7 +5V 400k
T1IN
11
+5V 400k
T1
T2 3 T3 1 T4 24 4 R1IN R1 5k 23 R2IN R2 5k 16 R3IN R3 5k 21 SHUTDOWN 8 T4 OUT T3 OUT T2 OUT
14
T1 OUT
T2 IN
6
T2IN
10 12
+5V 400k
T2 7 13 R1IN R1 5k T2 OUT
T3 IN T4 IN R1 OUT
+5V 400k 18 +5V 400k
19 5
R1 OUT
R2 OUT
9 R2 5k
8
R2IN
22 R2 OUT
17 15 R3 OUT 20 EN
NOTE: 1. Either 0.1F or 1F capacitors may be used. The V+ capacitor may be terminated to V CC or to GND.
3
HIN232 thru HIN241 Pinouts
(Continued) HIN237 (SOIC) TOP VIEW
T3OUT T1OUT T2OUT 1 2 3 24 T4OUT 23 R2IN 22 R2OUT 21 T5IN 20 T5OUT 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+ T2OUT 1 T1OUT 2 R2 IN 3 R2 OUT 4 T1IN 5 R1 OUT 6 R1 IN 7 GND VCC 8 9 24 T3OUT 23 R3IN 22 R3OUT 21 T4IN 20 T4OUT 19 T3IN 18 T2IN 17 R4OUT 16 R4IN 15 V14 C213 C2+
HIN238 (PDIP, SOIC) TOP VIEW
R1 IN 4 R1OUT 5
T2IN 6 T1IN 7 GND VCC 8 9
C1+ 10 V+ 11 C1- 12
C1+ 10 V+ 11 C1- 12
+5V 9 1F 10 C1+ + 12 C113 C2+ + 14 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 1F 1F
+5V 9 10 C1+ + 12 C113 C2+ + 14 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 1F
1F
V- 15 1F + 2 T1OUT
1F
V- 15 + 2 1F T1 OUT
T1 IN
+5V 400k 7 +5V 400k 6 +5V 400k 18 +5V 400k 19 +5V 400k 21 5
T1IN
+5V 400k 5 +5V 400k
T2 3 T3 T2OUT T2IN 18
T2 1 T3 T2 OUT
T2 IN
T3 IN T4 IN T5 IN R1 OUT
1
T3OUT T4OUT T5OUT R1 IN
T3IN T4IN R1OUT
+5V 400k 19 +5V 400k
24
T3 OUT T4 OUT R1IN
T4 24 T5 20 4 R1 5k 23 R2 IN R2 5k 16 R3 IN R3 5k R4OUT 17 R3OUT 22 4 R2OUT 21 6
T4 20 7 R1 5k 3 R2IN R2 5k 23 R3IN R3 5k 16 R4IN R4 5k
22 R2 OUT
17 R3 OUT
8 8
4
HIN232 thru HIN241 Pinouts
(Continued)
R4OUT R5OUT NC SHUT DOWN EN
T5OUT
HIN239 (PDIP, SOIC) TOP VIEW
HIN240 (MQFP)
R4IN R5IN T4IN T3IN NC
R1OUT 1 R1IN 2 GND 3 VCC 4 V+ 5 C1+ 6 C1- 7 V- 8 R5IN 9 R5OUT 10 R4OUT 11 R4IN 12
24 T1IN 23 T2IN 22 R2 OUT 21 R2 IN 20 T2OUT 19 T1OUT 18 R3 IN 17 R3 OUT 16 T3IN 15 NC 14 EN 13 T3OUT NC T5IN R3OUT R3IN T4OUT T3OUT T1OUT T2OUT NC R2IN NC 1 44 43 42 41 40 39 38 37 36 35 34 33 2 32 3 4 5 6 7 8 9 31 30 29 28 27 26 25 NC NC NC VC2C2+ C1V+ C1+ NC NC
24 10 11 23 12 13 14 15 16 17 18 19 20 21 22
GND
NC
NC
NC
R2OUT
R1OUT
T2IN
T1IN
R1IN
+5V +5V 4 6 1F (NOTE) + 7 C1+ C1VCC +10V TO -10V VOLTAGE INVERTER T1 V+ 1F 5 1F + 19 1F T1 OUT V- 8 +7.5V TO +13.2V (NOTE) 19 25 VCC C1+ + +5V TO 10V 27 C1- VOLTAGE DOUBLER 28 C2+ +10V TO -10V + 29 VOLTAGE INVERTER C2+5V T1 400k 15 +5V 400k 14 +5V 400k 37 +5V 400k 38 +5V 400k 2 16 R1 18 R3IN R3 11 R4OUT R4 10 R5OUT 14 EN 3 EN R5 5k 36 R5OUT 42 R5 18 5k 43 SHUTDOWN 5k 9 R5IN 39 R4OUT R4 5k 35 R5IN 5k 12 R4IN R3OUT R3 5k 40 R4IN R2OUT R2 3 5k 4 R3IN 13 5k 10 R2IN T2 8 T3 6 T4 5 T5 T4 OUT T5 OUT R1IN T3 OUT T2 OUT 1F V+ 26 +
VCC
V-
30 1F 7 T1 OUT
T1IN
+5V 400k 24 +5V 400k +5V 400k
T1IN T2IN
T2 20 T3 13 2 R1IN R1 5k 21 R2IN R2 5k T5IN R1OUT T4IN T3 OUT T3IN T2 OUT
T2IN
23
T3IN R1OUT
16 1
41 17
22 R2OUT
17 R3OUT
NOTE: For V+ > 11V, use C1 0.1F.
5
NC
HIN232 thru HIN241 Pinouts
(Continued) HIN241 (SOIC, SSOP) TOP VIEW
T3OUT 1 T1OUT 2 T2OUT 3 R2IN 4 R2 OUT 5 T2 IN 6 T1 IN 7 R1 OUT 8 R1IN 9 GND 10 VCC 11 C1+ 12 V+ 13 C1- 14 28 T4OUT 27 R3IN 26 R3OUT 25 SHUTDOWN 24 EN 23 R4IN 22 R4OUT 21 T4IN 20 T3IN 19 R5OUT 18 R5IN 17 V16 C215 C2+
+5V 11 1F 12 C1+ + 14 C115 C2+ + 16 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 13 + 1F
1F
V- 17 + 1F 2 T1 OUT T2 OUT
T1IN T2IN
+5V 400k 7 +5V 400k 6 +5V 400k
T2 3 T3 1 T4 28 9 R1 5k 4 R2IN R2 5k 27 R3IN R3 5k 23 R4IN R4 5k 18 R5IN R5 5k 25 SHUTDOWN 10 T4 OUT R1IN T3 OUT
T3IN
20
T4IN R1OUT
+5V 400k 21 8
5 R2OUT 26 R3OUT 22 R4OUT 19 R5OUT 24 EN
6
HIN232 thru HIN241
Absolute Maximum Ratings
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V) V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Thermal Information
Thermal Resistance (Typical, Note 3) JA ( oC/W) 16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70 16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95 44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC, SSOP, MQFP - Lead Tips Only)
Operating Conditions
Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 2. Only HIN239. For V+ > 11V, C1 must be 0.1F. 3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
PARAMETER SUPPLY CURRENTS Power Supply Current, ICC
Test Conditions: VCC = +5V 10%, TA = Operating Temperature Range TEST CONDITIONS MIN TYP MAX UNITS
No Load, TA = 25oC
HIN232 HIN236-238, HIN240-241 HIN239
-
5 7 0.4 5.0 1
10 15 1 15 10
mA mA mA mA A
V+ Power Supply Current, ICC No Load, TA = 25oC Shutdown Supply Current, ICC(SD)
No Load, TA = 25oC TA = 25oC
HIN239
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL Input Logic High, VlH TIN, EN, Shutdown TIN EN, Shutdown Transmitter Input Pullup Current, IP TTL/CMOS Receiver Output Voltage Low, VOL TTL/CMOS Receiver Output Voltage High, VOH RECEIVER INPUTS RS-232 Input Voltage Range VIN Receiver Input Impedance RIN Receiver Input Low Threshold, VlN (H-L) Receiver Input High Threshold, V IN (L-H) Receiver Input Hysteresis V HYST TIMING CHARACTERISTICS Baud Rate (1 Transmitter Switching) RL = 3k 120 kbps VIN = 3V VCC = 5V, TA = 25oC VCC = 5V, TA = 25oC -30 3.0 0.8 0.2 5.0 1.2 1.7 0.5 +30 7.0 2.4 1.0 V k V V V TIN = 0V IOUT = 1.6mA IOUT = -1.0mA 2.0 2.4 3.5 15 0.1 4.6 0.8 200 0.4 V V V A V V
7
HIN232 thru HIN241
Electrical Specifications
PARAMETER Output Enable Time, tEN Output Disable Time, tDIS Propagation Delay, tPD Instantaneous Slew Rate SR Transition Region Slew Rate, SRT TRANSMITTER OUTPUTS Output Voltage Swing, TOUT Output Resistance, ROUT RS-232 Output Short Circuit Current, ISC NOTE: 4. Guaranteed by design. Transmitter Outputs, 3k to Ground VCC = V+ = V- = 0V, VOUT = 2V TOUT shorted to GND 5 300 9 10 10 V mA Test Conditions: VCC = +5V 10%, TA = Operating Temperature Range (Continued) TEST CONDITIONS HIN236, 239, 240, 241 HIN236, 239, 240, 241 RS-232 to TTL CL = 10pF, RL = 3k, TA = 25oC (Note 4) RL = 3k, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching MIN TYP 400 250 0.5 3 MAX 30 UNITS ns ns s V/s V/s
VOLTAGE DOUBLER S1 VCC + GND S3 RC OSCILLATOR C1C1 + S4 C3 VCC GND S7 C1+ S2 V+ = 2VCC S5
VOLTAGE INVERTER C2 + S6 GND + C2C2 + S8 C4 V- = -(V+)
FIGURE 1. CHARGE PUMP
Detailed Description
The HIN232 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (except HIN239), feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver.
application uses 1F capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN236, 240 and 241), SHUTDOWN control line set to logic "1", the charge pump is turned off, V+ is pulled down to V CC , V- is pulled up to GND, and the supply current is reduced to less than 10A. The transmitter outputs are disabled and the receiver outputs are placed in the high impedance state.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 16kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase one, C2 is also charged to 2VCC , and then during phase two, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200, and the output impedance of the voltage inverter section (V-) is approximately 450. A typical
Transmitters
The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400k pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of 5V minimum with the worst case conditions of: all transmitters driving 3k minimum load
8
HIN232 thru HIN241
impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/s. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300 with 2V applied to the outputs and VCC = 0V.
V+ VCC 400k TXIN GND < TXIN < VCC V300 TOUT V- < VTOUT < V+
(VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the 3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis to improve noise rejection. The receiver Enable line EN, when set to logic "1", (HIN236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode.
VCC RXIN -30V < RXIN < +30V GND 5k ROUT GND < VROUT < VCC
FIGURE 2. TRANSMITTER
Receivers
The receiver inputs accept up to 30V while presenting the required 3k to 7k input impedance even if the power is off
FIGURE 3. RECEIVER
TIN OR RIN TOUT OR ROUT VOL VOL tPHL tPLH
Average Propagation Delay =
tPHL + tPLH 2
FIGURE 4. PROPAGATION DELAY DEFINITION
Typical Performance Curves
TA = 25oC 12 SUPPLY VOLTAGE (|V|) V- SUPPLY VOLTAGE 1F 10 0.47F 8 0.10F 6 4 2 0 3.0 12 10 8 6 4 2 0 3.5 4.0 4.5 VCC 5.0 5.5 6.0 0 5 10 15 20 |ILOAD| (mA) 25 30 35 V- (VCC = 4.5V) V- (VCC = 5V) V+ (VCC = 5V) V+ (VCC = 4.5V) TRANSMITTER OUTPUTS OPEN CIRCUIT
FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING CAPACITORS
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
9
HIN232 thru HIN241 Test Circuits (HIN232)
+4.5V TO +5.5V INPUT 1F C3 1F C1 +
+ 1 C1+ 2 V+ 3 C14 C2+ 5 C2VCC 16 GND 15 T1OUT 14 R1IN 13 R1 OUT 12 T1 IN 11 T2 IN 10 R2 OUT 9 3k T1 OUTPUT RS-232 30V INPUT TTL/CMOS OUTPUT TTL/CMOS INPUT TTL/CMOS INPUT TTL/CMOS OUTPUT
1 C1+ 2 V+ 3 C14 C2+ 5 C26 V7 T2OUT 8 R2 IN
VCC 16 GND 15 T1 OUT 14 R1IN 13 R1OUT 12 T1 IN 11 T2 IN 10 R2OUT 9
-
1F + C2 1F C4
3k
T2 OUTPUT RS-232 30V INPUT VIN = 2V
FIGURE 7. GENERAL TEST CIRCUIT
Applications
The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where 12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5k resistor connected to V+. In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters.
-
+
6 V7 T2OUT 8 R2IN
ROUT = VIN/1 T2 OUT T1 OUT A
FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION
+5V
+ 1 16 2 3 HIN232 4 6 DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7)
C1 + 1F C2 + 1F TD
+
5 11 10 T1 T2 14 7 13 R1 8
TTL/CMOS RTS INPUTS AND 12 RD OUTPUTS R2 9 CTS 15
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
10
HIN232 thru HIN241
1 C1 + 1F TD TTL/CMOS INPUTS AND OUTPUTS RTS RD CTS 9 R2 R1 3 11 10 12 HIN232 T1 T2
4 5 14 7 13 8 15 16
-
+ C2 1F TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND
+
V- V+ 6 2 16 HIN232 1 4 5 T1 T2 14 7 13 R2 R1 8
+
C4
6
2
-
C3
-
+5V RS-232 INPUTS AND OUTPUTS
2F
2F
C1 + 1F DTR TTL/CMOS INPUTS AND OUTPUTS DSRS DCD R1
3 11 10 12 9
-
+ C2 1F DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7)
15
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
11
HIN232 thru HIN241 Die Characteristics
DIE DIMENSIONS 160 mils x 140 mils METALLIZATION Type: Al Thickness: 10kA 1kA SUBSTRATE POTENTIAL V+ PASSIVATION Type: Nitride over Silox Nitride Thickness: 8kA Silox Thickness: 7kA TRANSISTOR COUNT 238 PROCESS CMOS Metal Gate
Metallization Mask Layout
HIN240
T2 OUT T1OUT R2IN T3OUT T4OUT R3IN R3OUT T5IN
SHUTDOWN
R2OUT EN T2IN T5OUT
T1IN R1OUT
R4IN
R1IN
R4OUT T4IN
GND T3IN
R5OUT
VCC
R5IN
C1+
V+
C1-
C2+
C2-
V-
12
HIN232 thru HIN241 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280
A
E A2 L A C L
-AD BASE PLANE SEATING PLANE D1 B1 B D1 A1
A1 A2
-C-
B B1 C D D1 E
eA eC
C
e
0.010 (0.25) M C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 16 0.430 0.150
2.54 BSC 7.62 BSC 2.93 16 10.92 3.81
13
HIN232 thru HIN241 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2 -B-AD BASE PLANE -CSEATING PLANE D1 B1 B D1 A1 A2 L A C L E
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B B1 C D D1 E E1 e eA eB L N MIN 0.015 0.115 0.014 0.045 0.008 1.230 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 1.280 0.325 0.280 MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 31.24 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 32.51 8.25 7.11 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93
eA eC
C
e
0.010 (0.25) M C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
0.100 BSC 0.300 BSC 0.115 24 0.430 0.150 -
2.54 BSC 7.62 BSC 10.92 3.81 24
2.93
14
HIN232 thru HIN241 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 MAX 2.65 0.30 0.51 0.32 10.50 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.050 BSC 0.394 0.010 0.016 16 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 16 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
15
HIN232 thru HIN241 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 15.20 7.40 MAX 2.65 0.30 0.51 0.32 15.60 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.5985 0.2914
MAX 0.1043 0.0118 0.020 0.0125 0.6141 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.05 BSC 0.394 0.010 0.016 24 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 24 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
16
HIN232 thru HIN241 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 17.70 7.40 MAX 2.65 0.30 0.51 0.32 18.10 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.6969 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.7125 0.2992
B C D E

A1 0.10(0.004) C
e H h L N
0.05 BSC 0.394 0.01 0.016 28 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 28 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
17
HIN232 thru HIN241 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 GAUGE PLANE H 0.25(0.010) M BM
M28.209 (JEDEC MO-150-AH ISSUE B) 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.390 0.197 MAX 0.078 0.072 0.014 0.009 0.413 0.220 MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 MAX 2.00 1.85 0.38 0.25 10.50 5.60 NOTES 9 3 4 6 7 8o Rev. 1 3/95

A1 0.10(0.004) A2 C
E e H L N
e
B 0.25(0.010) M C AM BS
0.026 BSC 0.292 0.022 28 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 28 0o 8.20 0.95
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
18
HIN232 thru HIN241 Metric Plastic Quad Flatpack Packages (MQFP)
D D1 -D-
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE INCHES SYMBOL A A1 A2 MIN 0.004 0.077 0.012 0.012 0.515 0.389 0.516 0.390 0.029 44 0.032 BSC MAX 0.096 0.010 0.083 0.018 0.016 0.524 0.399 0.523 0.398 0.040 MILLIMETERS MIN 0.10 1.95 0.30 0.30 13.08 9.88 13.10 9.90 0.73 44 0.80 BSC MAX 2.45 0.25 2.10 0.45 0.40 13.32 10.12 13.30 10.10 1.03 NOTES 6 3 4, 5 3 4, 5 7 Rev. 2 4/99 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total. 7. "N" is the number of terminal positions.
0.13/0.23 0.005/0.009
-AE E1
-B-
b b1 D D1 E
e
PIN 1 SEATING A PLANE 0.076 0.003 12 o-16o 0.40 0.016 MIN 0 o MIN 0o-7o A2 A1 0.20 M C A-B S 0.008 -CDS b b1 0.13/0.17 0.005/0.007 BASE METAL WITH PLATING
E1 L N e
-H-
L
12o-16o
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at website www.intersil.com/quality/iso.asp.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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